CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a circuit board of high quality at a low cost capable of being manufactured at a small number of steps without being specially shaped in a wiring section, and a method for manufacturing the circuit board for manufacturing the board. SOLUTION: A punched piece 10 punched from a copper foil 9 is adhered to a polyimide tape 1 by a die 7 and a punch 8, thereby forming wirings 2.