| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for a semiconductor element by which leak failure and wrong alignment are not easily generated. SOLUTION: This package for semiconductor element consists of a metal base 1 which has a placing part 2 to place a semiconductor element on it, a metal frame 3 having a square cross-section, 3 which is connected to surround the placing part 2 on the metal base 1, and a metal lid which is connected to the frame 3. At least two opposing sides out of four are warped in a dent in a length direction, the maximum warp of each side is 0.2% of the length, or less. Therefore, when putting the lid and a seal ring together, seam welding of a corner 5 and four sides is perfectly done by the pressure of corners pushing each other, this enables welding with little current and prevents leak failure and wrong alignment. |
