| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be reduced in cost by reducing the number of components, processes, and jigs and tools and which can be increased in yield by reducing damages to a chip or package, and also to provide a method of manufacturing the same. SOLUTION: An LSI chip 1 having a bare chip structure is formed with bumps 3 on its surface. At least a side wall of the chip 1 is applied with protective resin 4. The protective resin 4 applied on the side wall of the chip 1 prevents the chipping or clacking of the chip 1. |
