| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer interconnection circuit board having a good appearance, sufficient dimensional stability and high adhesive force at a low cost and the multilayer interconnection circuit board obtained thereby. SOLUTION: The method for manufacturing the multilayer interconnection circuit board using a thermoplastic liquid crystal polymer film as an insulator comprises the steps of superposing the film 1 having a high heat resistance and a metal sheet 2, press bonding them by a pair of heating rolls 3, then forming a wiring circuit on the sheet 2, manufacturing a wiring circuit board 5 having high heat resistance, then disposing the boards 5 each having the high heat resistance on both upper and lower surfaces of a thermoplastic liquid crystal polymer film 6 having lower heat resistance than that of the film 1, and press bonding them by a pair of heating rolls 7, 7. |
