发明名称 SURFACE ACOUSTIC WAVE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a small-sized surface acoustic wave device that seals an element using a very easy method. SOLUTION: In the surface acoustic wave device S1, in which a surface acoustic wave element 15 whose exiting electrode 2 is formed to a lower side of a piezoelectric substrate 1 is placed on a base substrate 9, the circumferential part of which an external electrode 12 is formed, a lead electrode 21 connected to the exciting electrode 2 of the surface acoustic wave element 15 and an external electrode 12 of the base substrate 9 are connected via connection conductor (7, 19), an insulating recessed frame 5 surrounding the excitation electrode 2 is placed in a way of covering part of the lead electrode 21 and a sealing member 8 is filled to a recessed part of a recessed frame 5 to seal the piezoelectric substrate 1 and the base substrate 9 air tightly.
申请公布号 JP2001244786(A) 申请公布日期 2001.09.07
申请号 JP20000056200 申请日期 2000.03.01
申请人 KYOCERA CORP 发明人 YOKOTA HIROKO;OTSUKA KAZUHIRO
分类号 H03H9/25;H03H3/08;(IPC1-7):H03H9/25 主分类号 H03H9/25
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