METHOD FOR MOUNTING SEMICONDUCTOR DEVICE

摘要

PURPOSE: To provide a method for mounting a semiconductor device in which mounting cost can be reduced by decreasing the number of adhesive required for mounting a semiconductor device thereby decreasing the number of steps of the mounting process. CONSTITUTION: A rigid plate 3 for leveling is previously coated with nonconductive adhesive 7 which is transferred to the mounting face of a semiconductor device 1 simultaneously with leveling of a stud bump 2. The nonconductive adhesive is composed of thermosetting resin and curing time after mounting process is shortened by heating it starting from a process preceding the mounting process.