| 摘要 |
PURPOSE: A method for fabricating an electronic semiconductor device is provided to inexpensively mass-produce a small electronic semiconductor device, by eliminating the necessity for an elaborate unit for forming a contact part between the upper and lower portions of a printed circuit board. CONSTITUTION: A conductive board(1) is prepared. A semiconductor chip is attached to the first surface(1.1) of the board. An electrical connection part is formed from the semiconductor chip to the first surface of the board. The semiconductor chip and the electrical connection part are sealed with an insulation material to form a housing body(4). The second surface(1.2) opposite to the first surface is separated from the board to form terminal parts(5,5.1,5.2) which are electrically insulated from each other. |
