发明名称 RECTIFYING DIODE
摘要 <p>PURPOSE: A rectifying diode is provided to improve the reliability of a junction layer by controlling a thickness of the junction layer. CONSTITUTION: A support plate(12) is formed on a center portion of a socket(10). A semiconductor chip(14) is fixed on an upper portion of the support plate(12) by a junction layer(16). A head pin(20) is fixed on an upper portion of the semiconductor chip(14) by a junction layer(18). A protective case(22) is formed on an upper portion of the socket(10). A buffer material(24) is formed on an inner portion of the protective case(22). The first head portion(210) of the head pin(20) is formed with a head(211) and a head wire(212). The second head portion(210) of the head pin(20) is formed with an insertion groove(221) and a passing hole(222).</p>
申请公布号 KR20010084163(A) 申请公布日期 2001.09.06
申请号 KR20000008985 申请日期 2000.02.24
申请人 KEC CORP. 发明人 CHOI, YEON SIK;LEE, WON O;PARK, JUNG EON
分类号 H01L23/049;H01L29/861;(IPC1-7):H01L29/861 主分类号 H01L23/049
代理机构 代理人
主权项
地址