发明名称 |
RECTIFYING DIODE |
摘要 |
<p>PURPOSE: A rectifying diode is provided to improve the reliability of a junction layer by controlling a thickness of the junction layer. CONSTITUTION: A support plate(12) is formed on a center portion of a socket(10). A semiconductor chip(14) is fixed on an upper portion of the support plate(12) by a junction layer(16). A head pin(20) is fixed on an upper portion of the semiconductor chip(14) by a junction layer(18). A protective case(22) is formed on an upper portion of the socket(10). A buffer material(24) is formed on an inner portion of the protective case(22). The first head portion(210) of the head pin(20) is formed with a head(211) and a head wire(212). The second head portion(210) of the head pin(20) is formed with an insertion groove(221) and a passing hole(222).</p> |
申请公布号 |
KR20010084163(A) |
申请公布日期 |
2001.09.06 |
申请号 |
KR20000008985 |
申请日期 |
2000.02.24 |
申请人 |
KEC CORP. |
发明人 |
CHOI, YEON SIK;LEE, WON O;PARK, JUNG EON |
分类号 |
H01L23/049;H01L29/861;(IPC1-7):H01L29/861 |
主分类号 |
H01L23/049 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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