发明名称 Halbleiteranordnung mit einer Wärmesenke und Herstellungsverfahren der Wärmesenke
摘要 A semiconductor device (3) with a convex heat sink (4A) comprises: a semiconductor element (3) disposed within a space formed by leads of a lead frame (1), the semiconductor element (3) having bonding pads connected to the leads through wires (5) respectively; a convex heat sink (4A) made from a high heat-conductive material and formed so as to have an outer periphery of a size sufficiently large to overlap the leads (1), the semiconductor element (3) being disposed at a center portion of the heat sink (4A); an insulator (2A) disposed on the leads (1) and for bonding and fixing the semiconductor element (3) to the heat sink (4A); and a package of resin (6) for sealing except part of the leads (1) and the top surface of a projecting portion of the heat sink (4A); wherein the insulator (2A) has a shape like a tape so as to cover part of the leads (1) and extend along a bottom surface near a circumferential edge of the heat sink (4A), and the side surface of the projecting portion of the heat sink (4A) is scraped out into a curved surface. <IMAGE>
申请公布号 DE69427865(D1) 申请公布日期 2001.09.06
申请号 DE1994627865 申请日期 1994.12.16
申请人 SEIKO EPSON CORP., TOKIO/TOKYO 发明人 OTSUKI, TETSUYA;HAMA, NORIKATA
分类号 H01L23/433;H01L33/48;H01L33/64 主分类号 H01L23/433
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