发明名称 |
Wiring harness producing method, a subassembly device, a cover board, a wire laying board and an apparatus for producing a subassembly |
摘要 |
A subassembly M is produced on a board 201 of a subassembly line SL in a compressed mode of its layout mode on a wire laying board 11 of a main line ML. The subassembly M in the compressed mode is temporarily held on the board 201. The temporarily held subassembly M is arranged on the wire laying board 11 while being extended to its final mode.
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申请公布号 |
US2001019478(A1) |
申请公布日期 |
2001.09.06 |
申请号 |
US20010797312 |
申请日期 |
2001.03.01 |
申请人 |
IZUMI TAKA;YURI HIDETAKA;KURIHARA KIYOKAZU;YURIKUSA HIROAKI;VAUGHAN BRENDAN |
发明人 |
IZUMI TAKA;YURI HIDETAKA;KURIHARA KIYOKAZU;YURIKUSA HIROAKI;VAUGHAN BRENDAN |
分类号 |
H01B13/012;(IPC1-7):H02B1/20 |
主分类号 |
H01B13/012 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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