发明名称 Wiring harness producing method, a subassembly device, a cover board, a wire laying board and an apparatus for producing a subassembly
摘要 A subassembly M is produced on a board 201 of a subassembly line SL in a compressed mode of its layout mode on a wire laying board 11 of a main line ML. The subassembly M in the compressed mode is temporarily held on the board 201. The temporarily held subassembly M is arranged on the wire laying board 11 while being extended to its final mode.
申请公布号 US2001019478(A1) 申请公布日期 2001.09.06
申请号 US20010797312 申请日期 2001.03.01
申请人 IZUMI TAKA;YURI HIDETAKA;KURIHARA KIYOKAZU;YURIKUSA HIROAKI;VAUGHAN BRENDAN 发明人 IZUMI TAKA;YURI HIDETAKA;KURIHARA KIYOKAZU;YURIKUSA HIROAKI;VAUGHAN BRENDAN
分类号 H01B13/012;(IPC1-7):H02B1/20 主分类号 H01B13/012
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