| 摘要 |
PURPOSE: A socket for testing a semiconductor package is provided to test correctly packages of various standards by using only one test socket. CONSTITUTION: A package support portion(11) is formed on a bottom face of a socket main body(10). The package support portion(11) is connected with a sidewall(13) of the socket main body(10). A multitude of socket pin(13a) contacted with a lead frame(P1) of a package(P) is formed on the sidewall(13). A multitude of substrate connection pin(14a) is formed on the bottom face of the socket main body(10) corresponding to the socket pins(13a). An adapter loading groove(12a) for loading a socket adapter(20) is formed on the bottom face of the socket main body(10). A combination groove(12b) of a combination screw(30) is formed inside the adapter loading groove(12a).
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