High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants

摘要

A thermosetting resin system including an epoxy resin, a bismaleimide, a cyanate ester and a co-curing agent that is an aromatic moiety having unsaturated aliphatic groups and glycidyl ether groups is provided. Preferred co-curing agents are 2-allylphenyl glycidyl ether and 2,2'-diallylbisphenol A diglycidyl ether. The resin system can be employed as an encapsulant for electronic components and as dielectric layers with microvias on printed circuits.