发明名称 Method for producing a semiconductor device
摘要 Disclosed is a simplified technique of introducing a metal element capable of promoting the crystallization of silicon into an amorphous silicon film to be crystallized, and of removing the metal element from the film. An amorphous silicon film 102 is formed on a substrate, a mask 103 is formed thereon, and a nickel-containing PSG film is further formed thereover. This is heated at 560° C. to thereby make nickel diffused in the direction 106, and the film is crystallized. Next, this is further heated at 850° C. to thereby make phosphorus diffused into the region 107, in which nickel is gettered by the thus-diffused phosphorus. Thus, the crystallization of silicon is promoted by the metal element nickel, and the nickel is then removed from the crystallized silicon film.
申请公布号 US2001019878(A1) 申请公布日期 2001.09.06
申请号 US20010824688 申请日期 2001.04.04
申请人 OHTANI HISASHI 发明人 OHTANI HISASHI
分类号 H01L21/20;H01L21/322;H01L21/336;H01L29/786;(IPC1-7):C30B1/00;H01L21/36 主分类号 H01L21/20
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