发明名称 |
Production of a system carrier used for electronic components comprises providing the surface of a carrier plate with a grid-like recesses on defined sites by punching and galvanically refining |
摘要 |
Production of a system carrier (1) comprises providing the surface of a carrier plate (2) with a grid-like recesses (3, 3') on defined sites by punching and galvanically refining. An independent claim is also included for the system carrier produced. |
申请公布号 |
DE10006942(A1) |
申请公布日期 |
2001.09.06 |
申请号 |
DE2000106942 |
申请日期 |
2000.02.16 |
申请人 |
POSSEHL ELECTRONIC GMBH |
发明人 |
HERDEN, AXEL;WESTPHOELING, TIM |
分类号 |
H01L23/31;H01L23/495;(IPC1-7):H01L23/50;H01L23/13 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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