发明名称 |
Light emitting diode with a permanent substrate of transparent glass or quartz and the method for manufacturing the same |
摘要 |
A method of manufacturing a light emitting diode (LED) includes growing a light emitting region on a temporary substrate, bonding a transparent substrate of glass or quartz to the light emitting region and then removing the temporary substrate. A metal bonding agent also serving as an ohmic contact layer with LED is used to bond the transparent substrate to form a dual substrate LED element which is then heated in a wafer holding device that includes a graphite lower chamber and a graphite upper cover with a stainless steel screw. Because of the different thermal expansion coefficients between stainless and graphite, the stainless steel screw applies a pressure to the dual substrate LED element during the heating process to assist the bonding of the transparent substrate.
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申请公布号 |
US2001019134(A1) |
申请公布日期 |
2001.09.06 |
申请号 |
US20010815835 |
申请日期 |
2001.03.24 |
申请人 |
CHANG KUO-HSIUNG;LIN KUN-CHUAN;HORNG RAY-HUA;HUANG MAN-FANG;WUU DONG-SING;WEI SUN-CHIN;CHEN LUNG-CHIEN |
发明人 |
CHANG KUO-HSIUNG;LIN KUN-CHUAN;HORNG RAY-HUA;HUANG MAN-FANG;WUU DONG-SING;WEI SUN-CHIN;CHEN LUNG-CHIEN |
分类号 |
H01L33/00;(IPC1-7):H01L27/15;H01L31/12 |
主分类号 |
H01L33/00 |
代理机构 |
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