Production of integrated components comprises tensioning strip in frame, applying adhesive to join wafer and strip, welding connecting wires, filling bonding window

摘要

Production of integrated components made from a wafer (2) with several chips and a strip (4) having copper conducting pathways and landing pads for solder balls comprises; (i) holding the wafer using a holder (3); (ii) tensioning the strip in a frame (1); (iii) applying an adhesive to the wafer or strip; (iv) joining the wafer and strip; (v) welding connecting wires to the conducting pathways and chips; (vi) filling the bonding window with a filler; (vii) placing solder balls on the landing pads; and (viii) removing the finished component from the frame.