Electronic device with double-wire bonding, manufacturing method thereof, and method for checking intactness of bonding wires of this electronic device

摘要

An electronic device having first and second external pins; first and second pads connected to the first external pin by respective bonding wires; and third and fourth pads connected to the second external pin respective bonding wires, and to a first common line by respective resistors. By means of a circuit configuration of this type, the intactness of the bonding wires can easily be checked by carrying out a simple resistance measurement between the first and the second external pin.