| 摘要 |
The housing of ball grid array (BGA) type comprises a chip (1) mounted on a tape automated bonding (TAB) technology, and a reinforcement plate (14), which is electrically neutral and embedded in the moulding, laid flat with respect to the chip and onto the face of flexible tapee opposite to that receiving the chip. The reinforcement plate (14) extends over both sides of chip on the tape in a manner to rigidify the assembly of chip mounted on tape, and covers totally and in a watertight manner the space between the chip and the tape. The housing allows the dissipation of power emitted from the chip through the tape, and also comprises a thermal dissipator (15) positioned on the rear face of chip. The reinforcement plate (14) is dimensioned as a function of maximum size determined by the chip (1) and acceptable for the dimensions of housing. In a variant of the device, the thermal dissipator corresponds to a card supporting the housing. The method for moulding includes the positioning of tape-chip assembly in the interior of first part of mould having a cavity for the chip and side borders for supporting the tape, the positioning of reinforcement plate, the positioning of second part of mould on the tape-chip assembly with supporting on the tape on both sides of chip so as to havee the tape tightened in a waterproof manner between two parts of mould, and the injection of a resin into the interior of second part of mould. The size of cavity in the second part of mould is determined as a function of maximum size of chip acceptable for the housing. |
