发明名称 |
Method for laser soldering |
摘要 |
There is disclosed herein a method for laser soldering, comprising the steps of: (a) providing an electronic component 10 having at least two terminations 12 thereon; a dielectric substrate 14 having a first surface 16 on a first side 18 thereof, a second surface 20 on a second side 22 thereof, and at least two mounting pads 24 arranged on the first surface 16 in matched relation with the terminations 12 of the electronic component 10; and a diode laser 50; (b) depositing solder paste 26 atop the mounting pads 24; (c) placing the electronic component 10 atop the substrate 14 such that each termination 12 rests generally atop its respective mounting pad 24; and (d) directing laser energy 70 from the diode laser 50 to at least one of the mounting pads 24 from the second side 22 of the substrate 14 for a predetermined time, such that the solder paste 26 atop the at least one of the mounting pads 24 is melted. <IMAGE> |
申请公布号 |
EP0964608(A3) |
申请公布日期 |
2001.09.05 |
申请号 |
EP19990304257 |
申请日期 |
1999.06.01 |
申请人 |
FORD MOTOR COMPANY |
发明人 |
MEYER, BERNARD ALLEN;COYNER, REXANNE M.;GLOVATSKY, ANDREW ZACHARY;LEMECHA, MYRON;SINKUNAS, PETER JOSEPH |
分类号 |
B23K1/005;H05K3/34 |
主分类号 |
B23K1/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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