发明名称 Mounting structure for mounting power elements to heat dissipation member
摘要 <p>A power element mounting structure for use in a brushless motor comprises a circuit board; a spring plate of metal, the spring plate being resiliently mounted, through a first mounting structure, on the circuit board keeping a given space therebetween; a plurality of power elements disposed on the spring plate to form a semi-assembled unit; a heat dissipation member of metal having a plurality of heat dissipation fins on an outer surface thereof, the heat dissipation member being mounted, through a second mounting structure, on the semi-assembled unit in such a manner that an inner surface thereof faces toward the power elements; and a plurality of spring pieces defined by the spring plate, the spring pieces being arranged to press the power elements against the inner surface of the heat dissipation member. <IMAGE></p>
申请公布号 EP1130744(A2) 申请公布日期 2001.09.05
申请号 EP20010100324 申请日期 2001.01.04
申请人 CALSONIC KANSEI CORPORATION 发明人 SUNAGA, HIDEKI;OHIRA, SHIGENORI;SANO, NARIHITO;YAMADA, KAZUNORI;OBA, TAKESHI
分类号 H01L23/40;H02K11/04;H05K7/20 主分类号 H01L23/40
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