发明名称 |
Method and component for forming an embedded resistor in a multi-layer printed circuit |
摘要 |
A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of a resistive material is disposed on a second side of the film substrate.
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申请公布号 |
US6284982(B1) |
申请公布日期 |
2001.09.04 |
申请号 |
US20000641304 |
申请日期 |
2000.08.18 |
申请人 |
GA-TEK INC. |
发明人 |
KUSNER MARK;CENTANNI MICHAEL A. |
分类号 |
H05K1/09;H05K1/16;H05K3/02;H05K3/38;H05K3/46;(IPC1-7):H05K1/03 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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