PASTE MATERIAL FOR FORMING METALLIC FILM CONTAINING METAL COMPLEX

摘要

PROBLEM TO BE SOLVED: To provide a novel paste material applicable to a base material, such as a thin plastic film, suitable for size and thickness reduction. SOLUTION: The paste material containing at least one kind of (1) a metal complex having a phosphinic ligand and acetylenic ligand, (2) a metal complex having the phosphinic ligand and organic sulfur ligand, (3) a metal complex having the acetylenic ligand and the organic sulfur ligand and having a quaternary ammonium salt as paired cation and (4) a gold complex containing the organic sulfur ligand and gold at a ratio of 1:1 (molar ratio).