| 摘要 |
For the electrical testing of base material for manufacturing printed circuit boards, firstly smooth edges to the copper layers of the base material, free of deformation, are produced, preferably in a milling process, which base material is subsequently subjected to testing for a sufficiently high level of electrical resistance between the two copper layers. Successful resistance testing is followed by testing for the dielectric strength of the insulating layer of the base material by measuring the current conduction produced as a result of a disruptive breakdown. This process serves to reduce the amount of processed base material which is rejected, on which, at the present state of the art, there is no electrical testing prior to processing.
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