发明名称 Flerskiktigt integrerat substrat och framställningsförfarande för flerskiktigt keramiskt element
摘要 A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves.
申请公布号 FI20010401(A) 申请公布日期 2001.09.04
申请号 FI20010000401 申请日期 2001.02.28
申请人 MURATA MANUFACTURING CO.,LTD 发明人 SAKAI,NORIO;IIDA,KAZUHIRO
分类号 H01G4/12;H01G4/30;H01L21/48;H01L23/58;H05K1/02;H05K1/03;H05K3/00;H05K3/46;(IPC1-7):C04B 主分类号 H01G4/12
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