发明名称 |
Flerskiktigt integrerat substrat och framställningsförfarande för flerskiktigt keramiskt element |
摘要 |
A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves. |
申请公布号 |
FI20010401(A) |
申请公布日期 |
2001.09.04 |
申请号 |
FI20010000401 |
申请日期 |
2001.02.28 |
申请人 |
MURATA MANUFACTURING CO.,LTD |
发明人 |
SAKAI,NORIO;IIDA,KAZUHIRO |
分类号 |
H01G4/12;H01G4/30;H01L21/48;H01L23/58;H05K1/02;H05K1/03;H05K3/00;H05K3/46;(IPC1-7):C04B |
主分类号 |
H01G4/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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