POLYIMIDE COMPOSITION FOR INSULATING FILM, INSULATING FILM THEREFROM AND METHOD OF FORMING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a composition for polyimide insulating film that has excellent storage stability (a relatively low viscosity is constantly maintained) good printability and gives the insulating film (cured film) that has the conflicting properties of solvent resistance, heat resistance and flexibility, the insulating film therefrom and a method of forming the insulating film. SOLUTION: The objective composition of polyimide insulating film characteristically comprises (a) 100 pts.wt. of an organic solvent-soluble polyimide-siloxane that is obtained from the tetra-carboxylic acid component, the diamine component including 45-90 mol.% of diamino-polysiloxane represented by the general formula, 0.5-40 mol.% of a polar group-bearing aromatic diamine and 0-50 mol.% of a plurality of benzene rings-bearing aromatic diamine, (b) 2-40 pts.wt. of a polyvalent isocyanate and (c) an organic solvent.