| 摘要 |
A multichip module (MCM) of the present invention includes a first substrate formed with through holes and having shield electrodes arranged therein. At least one semiconductor device is mounted on one major surface of the first substrate and electrically and mechanically connected to the first substrate by a first conductive material. A second substrate is mounted on the other major surface of the first substrate and formed with through holes. At least one filter device is mounted on the other major surface of the first substrate and electrically and mechanically connected to the first substrate by a second conductive material. The second substrate is electrically connected to the semiconductor device by the through holes and first conductive material. The MCM is capable of enhancing the efficient mounting of devices and promoting easy insulation between the devices.
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