发明名称 |
Method for mounting integrated circuits on printed circuit boards |
摘要 |
An improved method for mounting tape carrier package type integrated circuits on printed circuit boards. In the method, some of leads of the integrated circuit are preliminarily soldered with corresponding lead pattern on the printed circuit board after the integrated circuit is aligned on the printed circuit board so that the integrated circuit is prevented from being disordered while the printed circuit board including the integrated circuit aligned thereon is transferred to a soldering apparatus.
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申请公布号 |
US6284996(B1) |
申请公布日期 |
2001.09.04 |
申请号 |
US19980124678 |
申请日期 |
1998.07.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM CHOUL-SU;KIM WOO-SIK;WOO BYUNG-WOO;TSUKUE MASAHARU |
分类号 |
B23K1/012;H05K3/34;(IPC1-7):B23K1/00;B23K31/02;B23K31/00 |
主分类号 |
B23K1/012 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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