| 摘要 |
An apparatus for polishing a semiconductor wafer is provided comprising a wafer carrier to provide a force against a wafer and a rotating polishing pad during the polishing operation and a polishing slurry dispenser device disposed to dispense the slurry toward the pad preferably as a stream or more preferably drops toward the pad surface and a curtain of air to intersect the slurry at or near the polishing pad surface. The wafer is polished using less slurry than a conventional polishing apparatus while still maintaining the polishing rates and polishing uniformity of the prior art polishing apparatus. A preferred dispenser is an elongated housing having a slurry tube and air tube therein each tube having a plurality of spaced apart slurry openings and air openings along its longitudinal axis which tube is preferably positioned radially over at least one-half the diameter of the polishing pad. A polishing slurry is directed from the slurry tube toward the surface of the pad, preferably in the form of drops, and the air from the air tube forms an air curtain, with the air curtain intersecting the slurry drops preferably at or slightly above the pad surface to atomize the slurry.
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