| 摘要 |
A method for producing a semiconductor device, comprises the steps of: introducing a plurality of semiconductor element supporting substrates or semiconductor elements into a conductive-ball attaching system for collectively attaching conductive balls onto the supporting substrates or semiconductor elements; detecting the position of a defective substrate or defective semiconductor element of the introduced semiconductor element supporting substrates or semiconductor elements, or an undesired position, at which it is not necessary to load the conductive balls; vacuum holding a plurality of conductive balls, which are stored in the conductive-ball attaching system, by conductive-ball holding means; and selectively attaching the plurality of conductive balls, which are vacuum-held by the conductive-ball holding means, onto a desired supporting substrate or semiconductor element of the supporting substrates or semiconductor elements introduced into the conductive-ball attaching system, wherein the conductive-ball holding means selectively vacuum holds the conductive balls so that just enough conductive balls are attached onto the peripheral portion of a wafer, on which semiconductor elements are irregularly arranged, and so that the conductive balls are not attached onto the defective supporting substrate or defective semiconductor element. Thus, it is possible to provide a method for producing a semiconductor device, which is able to load conductive balls onto BGA substrates or semiconductor elements capable of selectively holding the conductive balls so that just enough conductive balls are attached onto the peripheral portion of a wafer, on which the semiconductor elements are irregularly arranged, and so that the conductive balls are not attached onto defective BGA substrates or semiconductor elements.
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