发明名称 Method for correlating processor and part temperatures using an air temperature sensor for a conveyorized thermal processor
摘要 A method for aligning a boundary condition temperature in a thermal processor utilizes an air temperature measurement. During the thermal process, air temperature measured along an interval series forms an air profile and provides a reference to which the boundary condition temperature may be aligned. A method for aligning a part temperature profile to the processor temperature profile uses the measured air temperature to adjust the part temperature profile, so as to be synchronized with the air temperature profile. These procedures may be used in conjunction with setpoint parameter prediction for attaining a target part temperature response.
申请公布号 US6283379(B1) 申请公布日期 2001.09.04
申请号 US20000504015 申请日期 2000.02.14
申请人 KIC THERMAL PROFILING 发明人 KAZMIEROWICZ PHILIP C.;SCHULTZ STEVEN ARTHUR
分类号 G05D23/19;H05K3/34;(IPC1-7):G05B21/00;F21B9/06 主分类号 G05D23/19
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