| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad for mechanically flattening a surface of an insulation layer formed on a silicone substrate or metallic wiring capable of providing a stable and high polishing rate, reducing a global difference in steps, and preventing dishing in the metallic wiring. clogging, and permanent set in fatigue of a surface layer part. SOLUTION: This polishing pad has microrubber A hardness of 80 degrees or more, contains a polymer polymerized from polyurethane and a vinyl compound, and has one or no glass transition point. |
