| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a device for laser beam machining capable of preventing sharp rise in running cost. SOLUTION: A stage 7 holds a working object 6. A laser beam P10 emitted from a laser oscillator 1 is condensed on the working object held by the stage. At a light condensing position on the working object, a hole is pierced. In the optical path of the laser beam between a condensing lens 4 and the stage, a protection film 5 formed of a polymer material is arranged.</p> |
