VACUUM HOLDING DEVICE FOR WAFER CONVEYING SYSTEM AND METHOD OF RELEASING VACUUM HOLDING CONDITION

摘要

PROBLEM TO BE SOLVED: To provide a conveying system capable of conveying even a thin wafer by making it possible to remove the wafer from a vacuum suction pad without breakage after it is conveyed. SOLUTION: This conveying system is provided with a vacuum suction pad 2 made of porous material connected with multiple air flow passages 21 to 27. A wafer S is vacuum held with its non-ground surface sucked via a vacuum suction pad 2 from the multiple air flow passages 21 to 27. A controlling means 4 is provided to control air to be jetted toward the wafer S from the multiple air flow passages 21 to 27 for releasing the vacuum holding condition.