发明名称 BORING METHOD BY LASER BEAM
摘要 <p>PROBLEM TO BE SOLVED: To provide a boring method which is able to form a micro hole by a simple method without large instrument investment. SOLUTION: Assuming that t1 is the time until a sensor outputs a detecting signal since it detects a laser beam passing through the pierced hole of a work, t2 is the time until the detecting signal derived from the sensor goes beyond limited value, and t3 is the time until the laser beam practically stops to irradiate since the signal goes beyond the limited value, total time of the times t1, t2, t3 is determined in such a way to be shorter than a time difference (T2-T3) between 1 cycle time T2 of pulse signal which composes a laser output command, and a pulse width T3.</p>
申请公布号 JP2001239387(A) 申请公布日期 2001.09.04
申请号 JP20000388016 申请日期 2000.12.21
申请人 HONDA MOTOR CO LTD 发明人 OKUMURA TOKUJI;WAKABAYASHI ITSUKI;TAKEKUMA HIDESHI;ISOGAI KAZUO
分类号 B23K26/00;B23K26/382;B60R21/20;B60R21/205;B60R21/2165 主分类号 B23K26/00
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