CIRCUIT BOARD RESIN COMPOSITION USED FOR SEMICONDUCTOR DEVICE EQUIPPED WITH GRID-LIKE ENERGIZING TERMINAL, CIRCUIT BOARD FOR SEMICONDUCTOR DEVICE EQUIPPED WITH GRID-LIKE ENERGIZING TERMINAL AND SEMICONDUCTOR DEVICE EQUIPPED WITH GRID-LIKE ENERGIZING TERMINAL

摘要

PROBLEM TO BE SOLVED: To exhibit excellent high heat resistance and low dielectric constant as a resin component excellent in productivity and adhesive properties for a circuit board for a semiconductor device equipped with grid-like energizing terminal used for a BGA(ball grid array)-type semiconductor device. SOLUTION: A dicyclopentadiene-type epoxy resin containing 10-35 wt.% of a compound having two aromatic hydrocarbon nuclei in a molecule as the resin component used for the circuit board 1 equipped with grid-like energizing terminal in Fig. 1 and a curing agent are used.