EPOXY RESIN COMPOSITION, PREPREG MADE THEREOF, LAMINATED BOARD CLAD WITH METALLIC FOIL AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To attain high bonding strength of a metallic foil for printed circuit integrated in the formation of an insulation layer produced by impregnating an epoxy resin in a substrate consisting of or composed mainly of a poly-p- phenylene terephthalamide fiber and containing a binder selected from (1) a resin binder composed mainly of a thermosetting resin, (2) pulp of a para-type aromatic polyamide fiber, (3) chopped meta-type aromatic polyamide fiber and (4) fibrid of a meta-type aromatic polyamide fiber. SOLUTION: The epoxy resin composition to be impregnated in the above substrate has a curing agent/epoxy group equivalent ratio of 0.9-0.5, preferably 0.8-0.5. In the case of using a compound having phenolic hydroxy group as the curing agent, the lower limit of the equivalent ratio of the curing agent to the epoxy group is preferably set to >=0.7.