发明名称 |
COMPONENT MOUNTING DEVICE AND METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a component mounting device and a component mounting method allowing cycle time reduction by continuously performing temporary crimp and real crimp of the component. SOLUTION: The component mounting device comprises a component mounting part 11 having a holding part 12 for holding the component 70, a component supply part for supplying the component to the holding part, and a tape member supply part 40 for supplying a dirt preventing tape member 43 to the holding part. The dirt preventing tape member is provided with an opening for holding the component by the holding part.
|
申请公布号 |
JP2001239430(A) |
申请公布日期 |
2001.09.04 |
申请号 |
JP20000056025 |
申请日期 |
2000.02.28 |
申请人 |
SONY CORP |
发明人 |
OSONIWA KAZUMASA;KAWATANI NORIO;ICHIKAWA IWAO;YAMAUCHI MANABU |
分类号 |
B23P21/00;(IPC1-7):B23P21/00 |
主分类号 |
B23P21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|