发明名称 COMPONENT MOUNTING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a component mounting device and a component mounting method allowing cycle time reduction by continuously performing temporary crimp and real crimp of the component. SOLUTION: The component mounting device comprises a component mounting part 11 having a holding part 12 for holding the component 70, a component supply part for supplying the component to the holding part, and a tape member supply part 40 for supplying a dirt preventing tape member 43 to the holding part. The dirt preventing tape member is provided with an opening for holding the component by the holding part.
申请公布号 JP2001239430(A) 申请公布日期 2001.09.04
申请号 JP20000056025 申请日期 2000.02.28
申请人 SONY CORP 发明人 OSONIWA KAZUMASA;KAWATANI NORIO;ICHIKAWA IWAO;YAMAUCHI MANABU
分类号 B23P21/00;(IPC1-7):B23P21/00 主分类号 B23P21/00
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