发明名称 Method of forming a cobalt silicide layer by use of a TEOS through oxide film for ion-implantation process
摘要 A method of forming a cobalt silicide layer on a silicon region comprises the steps of: forming a TEOS oxide film on a surface of the silicon region; carrying out an ion-implantation process for implanting ions through the TEOS oxide film into the silicon region; carrying out a heat treatment to activate the ions implanted in the silicon region, whereby a silicidation reaction inhibitor layer concurrently formed on an interface between the TEOS oxide film and the surface of the silicon region; carrying out a dry etching to remove laminations of the TEOS oxide film and the silicidation reaction inhibitor layer from the surface of the silicon region; carrying out a cleaning process for cleaning the surface of the silicon region by subjecting the surface of the silicon region to an acidic solution and subsequently to a diluted hydrofluoric acid solution; and forming a cobalt silicide layer on the surface of the silicon region.
申请公布号 US6284662(B1) 申请公布日期 2001.09.04
申请号 US19990406715 申请日期 1999.09.28
申请人 NEC CORPORATION 发明人 MIKAGI KAORU
分类号 H01L21/302;H01L21/24;H01L21/265;H01L21/28;H01L21/285;H01L21/304;H01L21/306;H01L21/3065;H01L21/336;H01L29/78;(IPC1-7):H01L21/302 主分类号 H01L21/302
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