发明名称 |
Method of forming a cobalt silicide layer by use of a TEOS through oxide film for ion-implantation process |
摘要 |
A method of forming a cobalt silicide layer on a silicon region comprises the steps of: forming a TEOS oxide film on a surface of the silicon region; carrying out an ion-implantation process for implanting ions through the TEOS oxide film into the silicon region; carrying out a heat treatment to activate the ions implanted in the silicon region, whereby a silicidation reaction inhibitor layer concurrently formed on an interface between the TEOS oxide film and the surface of the silicon region; carrying out a dry etching to remove laminations of the TEOS oxide film and the silicidation reaction inhibitor layer from the surface of the silicon region; carrying out a cleaning process for cleaning the surface of the silicon region by subjecting the surface of the silicon region to an acidic solution and subsequently to a diluted hydrofluoric acid solution; and forming a cobalt silicide layer on the surface of the silicon region.
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申请公布号 |
US6284662(B1) |
申请公布日期 |
2001.09.04 |
申请号 |
US19990406715 |
申请日期 |
1999.09.28 |
申请人 |
NEC CORPORATION |
发明人 |
MIKAGI KAORU |
分类号 |
H01L21/302;H01L21/24;H01L21/265;H01L21/28;H01L21/285;H01L21/304;H01L21/306;H01L21/3065;H01L21/336;H01L29/78;(IPC1-7):H01L21/302 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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