发明名称 METHOD FOR CONTROLLING WIRE TAIL OF WIRE BONDER
摘要 PURPOSE: A controlling method of a wire tail of a wire bonder is provided to improve a quality and a productivity by effectively controlling the wire tail. CONSTITUTION: A wire bonder state is initialized in a start step(200). A tool of the wire bonder is aligned to the upper direction about die pads in an alignment step(201). A ball is connected to the die pad in a pad bonding step(202). A wire is withdrawn from the edge of the tool to form a loop in a looping step(203). The contact of the tool on the lead frame is detected by a contact sensor in a contact detecting step(204). The wire is connected to the lead frame in a stitching step(205). A value of 'T-S>D' is judged by a controlling part in a judgment step(206). The capital 'T' means a contact level detected by the tool on the upper part of the lead frame and the capital 'S' means a contact level when the lower part of the lead frame is well contacted on a heat block. The capital 'D' is a parameter. When the value of 'T-S>D' is false, the tool is quickly lifted in a high-speed lift control step(207). When the value of 'T-S>D' is true, the tool is slowly lifted in a low-speed lift control step(208). A wire tail is formed at the edge of the tool in a tail formation step(209). A ball is formed on the wire tail by a torch blade in a ball formation step(210). The completion of the wire bonding work is judged in another judgement step(211).
申请公布号 KR100309135(B1) 申请公布日期 2001.09.04
申请号 KR19950039313 申请日期 1995.11.02
申请人 HYNIX SEMICONDUCTOR INC. 发明人 MUN, YEONG GYU
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址