| 摘要 |
Disclosed is a multi-layered multi-chip module which comprises a substrate, a first electric shield line formed on the substrate, a passive element layer having passive elements and being formed on the first electric shield line, a second electric shield line formed on the passive element layer, an interconnection layer having a connection line electrically connected to the passive elements and being formed on the second electric shield line, a third electric shield line formed on the interconnection layer, a plurality of bumpers electrically connected to the connection line and formed on the outside of the third electric shield line, and a plurality of integrated circuits (IC) or electrical elements formed on the bumper. According to the present invention, the base band unit and the RF unit can be formed into a single module, and the size of the module can be reduced since the ICs and the passive elements are provided in the different layers. |
