Composite copper foil and manufacturing method thereof

摘要

A composite copper foil ( 10 ) comprises a carrier foil ( 12 ) formed by electrodeposition onto a cathode, the carrier foil ( 12 ) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer ( 14 ) is on the electrolyte side of said carrier foil ( 12 ). A thin functional foil ( 16 ) formed by deposition of copper has a front side in contact with the release layer ( 14 ) and an opposite back side. The electrolyte side of the carrier foil ( 12 ) has a surface roughness Rz less than or equal to 3.5 mum. There is also presented a method for manufacturing such a composite copper foil.