BURN-IN TEST MODULE OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A burn-in test module of a semiconductor package is provided to increase integration of the semiconductor package and to improve a speed at which the semiconductor package is mounted in the burn-in test module, by making a tray having the semiconductor package inserted into the burn-in test module in a process for testing a defect of the semiconductor package. CONSTITUTION: Package pockets(111) in which a completed semiconductor package(200) is loaded, are installed on an upper surface of a tray(110), separated at a predetermined interval and having a matrix arrangement structure. An insertion hole(112) into which a lead(210) of the semiconductor package is inserted is formed on a bottom surface of the package pocket. A multilayered circuit pattern connected to the insertion hole is formed on a lower surface of the package pocket. A plurality of pockets into which the tray is inserted are formed on an upper surface of a main board(120). A connection pad(122) inserted into a slot of a burn-in test chamber for testing the semiconductor package is formed in a portion of the main board. Connection patterns to which a test signal is applied, are formed in the connection pad, having a predetermined interval. A multilayered circuit pattern electrically connected to the connection pattern is formed on a lower surface of the pockets. A burn-in test module of the semiconductor package includes the tray and the main board.