| 摘要 |
PROBLEM TO BE SOLVED: To form an extremely small and high-accuracy protrusion corresponding to a package or the like composed of a full grid arrangement in such a way that a hig-viscosity organic photoresist is not used in an organic photoetching coating part when the protrusion is formed. SOLUTION: In the manufacturing method for an inspection probe board in accordance with this invention, the protrusion is formed on the copper foil, on one side, of a tape carrier material which comprises copper foils on both faces of the board. In the manufacturing method, for the inspection probe board, which is provided, a blind via is formed on the face of the copper foil on one side, the blind via and the copper foil on one side are plated so as to be then etched, a first wiring pattern is formed, the copper foil on the other side of the tape carrier material is etched so as to form a second wiring pattern, a metal film is formed partly on the second wiring pattern so as to be half etched, and the protrusion is formed.
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