| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a contact for a BGA type IC in which a sure positioning can be made with a solder ball of BGA type IC, and provide its contacting structure superior in an automatic handler. SOLUTION: One-half of contact pins 2a among contact pins 2 for the IC socket 1 for BGA are arranged in a row in the appointed direction, and the other one-half of contact pins 2b which are arranged in the row in the intersecting direction to the contact pins 2a, and by restoring forces in two directions composed of the restoring force by the contact pins 2a and the restoring force of the contact pin 2b, a position shift between the BGA type IC 6 and the IC socket 1 for BGA is modified.</p> |
