| 摘要 |
PROBLEM TO BE SOLVED: To perform the adsorption and removal of residual gas using a getter material independently of space limitation within a vacuum chamber. SOLUTION: Instead of conventional getter pump equipment using a getter material, an adsorption film 10 composed of getter material is provided onto the backside of a shield plate 20 disposed invariably in a vacuum chamber 30 of a sputtering system, and the adsorption and removal of residual gas using the getter material are carried out while obviating the necessity of a particular arrangement space. Moreover, because the shield plate 20 used in the sputtering system receives a large amount of energy and undergoes heating during film deposition by radiation such as forced heating for plasma film deposition, the getter material constituting the adsorption film 10 is heated by utilizing the heating of the shield plate 20, by which a gettering effect greater than that at ordinary temperature can be provided.
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