发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste of superior solderability, soldering strength, and solder consumption. SOLUTION: The conductive paste is composed of silver powder as the main ingredient, metal powder containing palladium or platinum of 0.5 or less weight percent, vehicle, and inorganic component. The vehicle comprises butyl carbitol, terpineol, resin, ethyl cellulose, and polyethylene oxide.
申请公布号 JP2001236826(A) 申请公布日期 2001.08.31
申请号 JP20000047209 申请日期 2000.02.24
申请人 SUMITOMO METAL MINING CO LTD 发明人 ADACHI YOSHINORI
分类号 C09D5/24;C09D201/00;H01B1/00;H01B1/22;H05K3/32;(IPC1-7):H01B1/22 主分类号 C09D5/24
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