| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface metallizing method by which the increase of temperature is reduced and a metallic film having high adhesion and joining strength with a base material can be deposited. SOLUTION: This method has a stage where an agent for metallic film deposition in which metallic hyperfine particles are dispersed into a prescribed solvent is prepared, a stage where the agent is brought into contact with the surface of a base material composed of an insulator, and a stage where the agent deposited on the surface of the base material is dried and heat-treated to melt and bond the metallic hyperfine particles.
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