MODULE COMPORTANT AU MOINS UNE PUCE ET SON INTERFACE DE COMMUNICATION, OBJET COMPORTANT UN MODULE ET PROCEDE DE REALISATION DESDITS MODULES

摘要

The invention concerns a method for making electronic devices comprising at least a chip (2) connected to a communication interface (32). The invention is characterised in that it comprises, for each chip, the following steps: providing the chip (2) in the form of a very thin semiconductor, said chip having at least a bump contact (8) on at least one of its faces (2a; 2b); providing an adhesive film (24) designed to receive the chip and its communication interface; transferring the chip onto a predetermined site of the adhesive support film with the or each bump contact electrically connected to a respective connection point of the communication interface; and transferring the whole assembly comprising the chip and the communication interface thus produced onto the adhesive film onto a support for which the chip is designed. The invention also concerns a module comprising at least a chip (2) and its communication interface assembled on an adhesive film (24) and an object comprising at least said modules.