| 摘要 |
PROBLEM TO BE SOLVED: To enable semiconductor substrates to undergo a polishing process on such a processing condition that the polished surface of the substrate can be continually observed because a polishing head smaller in diameter than the semiconductor substrate is used, the rotating speed and polishing pressure of a holder can be freely set while measuring the surface state and depth of polishing of the substrate, and consequently an optimal processing condition can be set for each substrate to enable the substrate to undergo a polishing process on an optimal processing condition. SOLUTION: A semiconductor substrate is held on a holder with a buried film in the semiconductor substrate set upwards, the substrate is rotated in a certain direction by rotating the holder, and a polishing head which is equal in diameter to or below the substrate and provided with a polishing cloth 24 that is pasted on its surface and equal in radius to or below the substrate is swung in the radial direction of the substrate, by which the buried film on the semiconductor substrate is flattened by polishing. |
