| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device mounting substrate and semiconductor device, which can cause a short circuit hard to occur in manufacturing the semiconductor device and can make many semiconductor devices from one mounting substrate. SOLUTION: A zigzag wiring 26 for alternately connecting one connection terminals 16a to the other connection terminals 16b across a dicing line 22 is formed between neighboring mounting regions in one block (20a and 20b, 20b and 20c, 20c and 20d, 20a and 20d). |
